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INTEGRATED CIRCUITS
DATA SHEET
TDA9880 Alignment-free multistandard vision and FM sound IF-PLL demodulator
Product specification Supersedes data of 1998 Aug 12 File under Integrated Circuits, IC02 1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
FEATURES * 5 V supply voltage * Gain controlled wide-band Vision Intermediate Frequency (VIF) amplifier (AC-coupled) * True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics and excellent pulse response) * Fully integrated VIF Voltage Controlled Oscillator (VCO), alignment-free * Digital acquisition help, VIF frequencies of 38.0, 38.9, 45.75 and 58.75 MHz * 4 MHz reference frequency input [signal from Phase-Locked Loop (PLL) tuning system] or operating as crystal oscillator * VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector, fast reaction time ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9880 TDA9880T SDIP20 SO20 DESCRIPTION plastic shrink dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm
TDA9880
* Precise fully digital Automatic Frequency Control (AFC) detector with 4-bit digital-to-analog converter * Fully integrated sound carrier trap for 4.5, 5.5, 6.0 and 6.5 MHz, controlled by reference signal * Alignment-free selective FM-PLL demodulator with high linearity and low noise * Digital frequency control, sound carrier frequencies 4.5, 5.5, 6.0 and 6.5 MHz * Stabilizer circuit for ripple rejection and to achieve constant output signals * Electrostatic discharge (ESD) protection for all pins. GENERAL DESCRIPTION The TDA9880(T) is an integrated circuit for multistandard vision IF signal processing and FM demodulation in TV and VTR sets.
VERSION SOT325-1 SOT163-1
1999 Jul 21
2
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
QUICK REFERENCE DATA SYMBOL VP IP PARAMETER supply voltage supply current -1 dB video at output see Fig.4 see Table 2 note 1 CONDITIONS MIN. 4.5 85 - 65 - - - - fVIF Vo(v)(p-p) VIF frequency window of digital acquisition help video output signal voltage (peak-to-peak value) differential gain differential phase -3 dB video bandwidth including sound carrier trap referenced to fVIF - TYP. 5 100 50 69 38.0 38.9 45.75 58.75 2.38 2.0 1.10 2 2
TDA9880
MAX. 5.5 115 100 - - - - - - 2.3 1.25 5 4
UNIT V mA V dB MHz MHz MHz MHz MHz V V % deg
Vi(sens)(VIF)(rms) VIF input voltage sensitivity (RMS value) GVIF(cr) fVIF VIF gain control range VIF frequencies
sound carrier off; see Fig.10 1.7 trap bypass mode; see Fig.10 0.95 - -
Gdif dif Bv(-3dB)(trap)
"NTC-7 Composite" "NTC-7 Composite"
CL < 20 pF; RL > 1 k; AC load; note 2 ftrap = 4.5 MHz (M/N standard) ftrap = 5.5 MHz (B/G standard)
3.95 4.90 30 30 56 25 5 6 7.5
4.05 5.00 36 36 60 28 6 8 10 600
- - - - - - - 10 12.5 750
MHz MHz dB dB dB dB MHz A A A
SC1 S/NW PSRR13 Bv(-1dB) Ich(max)(20) Idch(max)(20) Isink(14)
trap attenuation at first sound carrier M/N standard B/G standard weighted signal-to-noise ratio of video signal power supply ripple rejection at pin 13 -1 dB video bandwidth AGC maximum charge current at pin 20 AGC maximum discharge current at pin 20 sink current of tuner AGC at pin 14 maximum tuner gain reduction; V14 = 1 V; see Fig.4 see Fig.6; note 3 fripple = 70 Hz; video signal; grey level; see Fig.9 CL < 20 pF; RL > 1 k; AC load; trap bypass mode
450
AFCstps Io(source)(19) Io(sink)(19) Vo(intc)(rms)
AFC steepness I19/f AFC output source current at pin 19 AFC output sink current at pin 19 intercarrier output voltage (RMS value) V i(SC) ------------- = - 24 dB ; note 4 V i(PC) 3
0.85 160 160 -
1.05 200 200 49
1.25 240 240 -
A/kHz A A mV
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL Bintc(-3dB)(ul) Vo(AF)(8)(rms) THD8 BAF(-3dB) PARAMETER upper limit -3 dB intercarrier bandwidth audio output signal voltage at pin 8 (RMS value) total harmonic distortion at pin 8 -3 dB audio frequency bandwidth without de-emphasis; dependent on loop filter at pin 4 black picture white picture 6 kHz sine wave (black-to-white modulation) sound carrier subharmonics; f = 2.25 MHz 3 kHz AM(sup) AM suppression of FM demodulator 75 s de-emphasis; AM: f = 1 kHz; m = 0.3 referenced to 25 kHz FM deviation 25 kHz FM deviation; 75 s de-emphasis CONDITIONS MIN. 7.5 400 - 100 TYP. 9 500 0.15 120
TDA9880
MAX. - 600 0.5 -
UNIT MHz mV % kHz
S/NW(AF)
weighted signal-to-noise ratio of audio signal
50 45 40 35
56 51 46 40
- - - -
dB dB dB dB
40
46
-
dB
PSRR8 fFM fref(15) Vref(15)(rms) Notes
power supply ripple rejection at pin 8 fripple = 70 Hz; see Fig.9 frequency window of digital acquisition help for FM demodulator frequency of reference signal at pin 15 amplitude of reference signal source operation as input terminal at pin 15 (RMS value)
14 - - 80
20 225 4.0 -
- - - 400
dB kHz MHz mV
1. Values of video and sound parameters can be decreased at VP = 4.5 V. 2. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps (see Figs 13 to 18); H (s) is the absolute value of transfer function. 3. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard) weighted in accordance with "CCIR 567". 4. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal video signal with 1.1 V (p-p) as a reference:
V i ( SC ) --------------- ( dB ) + 6 dB 3 dB V i ( PC ) --------------------------------------------------------------20
1 V o(intc)(rms) = 1.1 V (p-p) x ---------- x 10 22 where:
V i ( SC ) 1 ---------- = correction term for RMS value, --------------- ( dB ) = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB, V i ( PC ) 22 6 dB = correction term of internal circuitry and 3 dB = tolerance of video output and intercarrier output amplitude Vo(intc)(rms).
1999 Jul 21
4
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dbook, full pagewidth
1999 Jul 21
RTOP CVAGC TAGC 14 TOP 3 AGC VAGC 20 RC VCO VIF1 VIF2 1 2 VIF-PLL
BLOCK DIAGRAM
Philips Semiconductors
Alignment-free multistandard vision and FM sound IF-PLL demodulator
external reference or 4 MHz crystal
trap disable switch CTR
REF 15 DIGITAL VCO CONTROL
AFC 19 AFC DETECTOR
TR 12
SOUND TRAPS 4.5 to 6.5 MHz
13 CVBS
video output 2 V (p-p) [1.1 V (p-p) without trap]
TDA9880
8 AUD
5
SUPPLY 17 VP 16 GND 18 VPLL 11 SIO
LOGIC 9 S0 10 S1
NARROW-BAND FM-PLL DETECTOR 7 FAGC 4 FMPLL 5 DEEM 6 AFD
audio output
sound intercarrier output VIF-PLL filter
CFAGC
CDEEM
CAFD
FM-PLL filter
de-emphasis decoupling
MHB506
Product specification
TDA9880
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
PINNING SYMBOL VIF1 VIF2 TOP FMPLL DEEM AFD FAGC AUD S0 S1 PIN 1 2 3 4 5 6 7 8 9 10 DESCRIPTION VIF differential input 1 VIF differential input 2 tuner AGC TakeOver Point (TOP) FM-PLL filter de-emphasis capacitor AF decoupling capacitor FM-PLL AGC capacitor audio output switch input S0 switch input S1 SYMBOL SIO TR CVBS TAGC REF GND VP VPLL AFC VAGC PIN 11 12 13 14 15 16 17 18 19 20
TDA9880
DESCRIPTION sound intercarrier output trap control video output tuner AGC output 4 MHz crystal or reference input ground supply supply voltage (+5 V) VIF-PLL filter AFC output VIF-AGC capacitor
handbook, halfpage
handbook, halfpage
VIF1 1 VIF2 2 TOP 3 FMPLL 4 DEEM 5
20 VAGC 19 AFC 18 VPLL 17 VP 16 GND
VIF1 1 VIF2 2 TOP 3 FMPLL 4 DEEM 5
20 VAGC 19 AFC 18 VPLL 17 VP 16 GND
TDA9880
AFD 6 FAGC 7 AUD 8 S0 9 S1 10
MHB072
TDA9880T
15 REF 14 TAGC 13 CVBS 12 TR 11 SIO AFD 6 FAGC 7 AUD 8 S0 9 S1 10
MHB106
15 REF 14 TAGC 13 CVBS 12 TR 11 SIO
Fig.2 Pin configuration for SDIP20.
Fig.3 Pin configuration for SO20.
1999 Jul 21
6
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
FUNCTIONAL DESCRIPTION Figure 1 shows the simplified block diagram of the integrated circuit. The integrated circuit comprises the following functional blocks: 1. VIF amplifier 2. Tuner-AGC and VIF-AGC 3. VIF-AGC detector 4. Frequency Phase-Locked Loop (FPLL) detector 5. VCO and Travelling Wave Divider (TWD) 6. Digital acquisition help and AFC 7. Video demodulator and amplifier 8. Sound carrier trap 9. Intercarrier mixer 10. FM demodulator and acquisition help 11. Audio amplifier 12. Internal voltage stabilizer. VIF amplifier The VIF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration. Tuner-AGC and VIF-AGC The AGC capacitor voltage is converted to an internal VIF gain control signal, and is fed to the tuner AGC to generate the tuner AGC output current at pin TAGC (open-collector output). The tuner AGC takeover point can be adjusted with RTOP. This allows the tuner to be matched to the SAW filter in order to achieve the optimum IF input level. VIF-AGC detector The AGC detector generates the required VIF gain control voltage for constant video output by charging or discharging the AGC capacitor. Gain control is performed by sync level detection. The newly developed AGC circuit provides fast reaction time to cope with `aeroplane fluttering'. The time constants for decreasing or increasing gain are nearly equal. Frequency Phase-Locked Loop (FPLL) detector The VIF amplifier output signal is fed into a Frequency Detector (FD) and into a Phase Detector (PD) via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. Digital acquisition help and AFC
TDA9880
After frequency lock-in the phase detector produces a DC current proportional to the phase difference between the VCO and the input signal. The DC current of either the frequency detector or the phase detector is converted into a DC voltage via the VIF-PLL filter, which controls the VCO frequency. VCO and Travelling Wave Divider (TWD) The Resistor Capacitor (RC) VCO operates as an integrated relaxation oscillator at double the picture carrier frequency. The control voltage required to tune the VCO to actually double the picture carrier frequency is generated by the FPLL detector and fed via the loop filter to the VCO control input terminal. The oscillator signal is divided-by-two with a TWD which generates two differential output signals with a 90 degrees phase difference independent of the frequency.
The integrated relaxation oscillator has a very wide frequency range from approximately 30 to 70 MHz (after the TWD). To prevent false locking of the FPLL and with respect to the catching range of the frequency detector of maximum 2.5 MHz, the Digital Acquisition Help (DAH) provides current into the loop filter until the VCO is in a frequency window of 2.3 MHz around the wanted VIF frequency. In this case the analog operating FPLL will lock the VCO to the VIF carrier and the acquisition help does not provide any current to the loop filter. The principle of the digital acquisition help is as follows: the VCO is connected to a downcounter, which is preset depending on the required VIF frequency. The counting time, as well as the counter control, is derived from a 4 MHz reference signal. This signal can be supplied from the internal 4 MHz crystal oscillator or from the 4 MHz reference oscillator of an external tuning system. The counting result after a counting cycle corresponds to the actual VCO frequency. The digital AFC is also derived from the counting result after a counting cycle by digital-to-analog converting the last four bits of the counter. Video demodulator and amplifier The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the `in phase' signal of the travelling wave divider output.
1999 Jul 21
7
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics. The video signal of 1.1 V (p-p) for nominal vision IF modulation is fed internally to the integrated sound carrier trap as well as to the VIF-AGC detector. The second stage of the video amplifier converts and amplifies the differential output signal from the sound carrier trap to the single-ended CVBS output signal at pin 13 with a 2 V (p-p) amplitude. Noise clipping is provided. Furthermore the trap can be bypassed by the implemented input switch of the second amplifier stage, forced by connecting pin 12 to ground. Sound carrier trap The sound carrier trap consists of a reference filter, a phase detector and the sound trap itself. A sound carrier reference signal is fed into the reference low-pass filter and is shifted by a nominal 90 degrees. The phase detector compares the original reference signal with the signal shifted by the reference filter and produces, at the external capacitor CTR, a DC voltage by charging or discharging the capacitor with a current proportional to the phase difference between both signals, respectively to the frequency error of the integrated filters. The DC voltage is converted to currents which control the frequency position of the reference filter and the sound trap. The sound trap itself is constructed of three separate traps to realize sufficient suppression of the first and second sound carrier. The right frequency position of the different standards is set by the sound carrier reference signal. Intercarrier mixer The intercarrier mixer is realized by a multiplier, operating in quadrature mode for suppression of low frequency video signals. The VIF amplifier output signal is fed to the intercarrier mixer and converted to an intercarrier frequency by the regenerated 90 degree picture carrier from the VCO. The mixer output signal is fed via a band-pass filter and amplifier for attenuation of the high frequency video signal components and carrier harmonics to the output pin 11. The intercarrier signal is fed also to the integrated FM demodulator. FM demodulator and acquisition help
TDA9880
The FM demodulator is realized as a narrow-band PLL with external loop filter, which provides the necessary selectivity. To achieve good selectivity, a linear phase detector and constant input level are required. The intercarrier signal from the intercarrier mixer is fed via a gain controlled amplifier to the phase detector and it's output signal controls (via the loop filter) the integrated relaxation oscillator. The possible frequency range is from 4 to 7 MHz. As a result of locking the oscillator frequency tracks with the FM modulation of the input signal; therefore, the oscillator control voltage is superimposed by the AF voltage. In this way the FM-PLL operates as an FM demodulator. The AF voltage is present at the loop filter and is fed via a buffer with 0 dB gain to the audio amplifier. The digital acquisition help operates in the same way as described in Section "Digital acquisition help and AFC". Audio amplifier The audio amplifier consists of two parts: 1. The AF preamplifier is an operational amplifier with internal feedback, high gain and high common mode rejection. The AF voltage from the PLL demodulator, by principle a small output signal, is amplified by 30 dB. A DC operating point control circuit (pin 6) decouples the AF amplifier from the DC voltage of the PLL. The low-pass characteristic of the amplifier reduces the harmonics of the intercarrier signal at the sound output terminal. If required, a de-emphasis network can be realized by the amplifier output resistance and an external capacitor. 2. The AF output amplifier (10 dB) provides the required output level by a rail-to-rail output stage. This amplifier makes use of an input selector for switching to mute state, automatically controlled by the mute switching voltage from the digital acquisition help in order to avoid lock-in noise. During normal operation the automatic audio mute function is not active. Application of a 2.2 k resistor between the intercarrier output (pin 11) and ground will activate the automatic audio mute function. Internal voltage stabilizer The band gap circuit internally generates a voltage of approximately 2.4 V, independent of the supply voltage and the temperature. A voltage regulator circuit, controlled by this voltage, produces a constant voltage of 3.55 V which is used as an internal reference voltage.
1999 Jul 21
8
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP Vn PARAMETER supply voltage voltage at pins 1 to 4, 6 to 10, 12 and 17 to 20 pin 14 tsc Tstg Tamb Ves short-circuit time to ground or VP storage temperature ambient temperature electrostatic handling voltage for all pins note 1 note 2 0 0 - -25 -20 -250 -3000 CONDITIONS IP = 115 mA; Tamb = 70 C; at - maximum chip temperature of 125 C MIN.
TDA9880
MAX. 5.5
UNIT V
VP 13.2 10 +150 +70 +250 +3000
V V s C C V V
Notes 1. Charge device model class A; machine model: discharging a 200 pF capacitor via a 0.75 H inductance. 2. Charge device model class B; human body model: discharging a 100 pF capacitor via a 1.5 k series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient TDA9880 (SDIP20) TDA9880T (SO20) CONDITIONS in free air 85 85 K/W K/W VALUE UNIT
1999 Jul 21
9
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
CHARACTERISTICS VP = 5 V; Tamb = 25 C; see Table 2 for input frequencies; M standard (fPC = 45.75 MHz; fSC = 41.25 MHz; PC/SC = 10 dB) is used for specification; Vi(VIF)(rms) = 10 mV (sync level); IF input from 50 via broadband transformer 1 : 1; DSB video modulation; 10% residual carrier; video signal in accordance with "NTC-7 Composite"; measurements taken in test circuit of Fig.19; unless otherwise specified. SYMBOL Supply (pin 17) VP IP Ptot Vi(sens)(VIF)(rms) Vi(max)(rms) Vint supply voltage supply current total power dissipation -1 dB video at output 1 dB video at output; note 2 note 1 4.5 85 - - 110 - 5 100 500 5.5 115 633 V mA mW V mV dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VIF amplifier (pins 1 and 2) VIF input voltage sensitivity (RMS value) maximum input signal voltage (RMS value) 50 - 0.7 100 - 1
internal IF amplitude difference within AGC range; between picture and sound f = 4.5 MHz carrier VIF gain control range lower limit -3 dB VIF bandwidth upper limit -3 dB VIF bandwidth differential input resistance differential input capacitance DC input voltage note 3 note 3 see Fig.4
GVIF(cr) BVIF(-3dB)(ll) BVIF(-3dB)(ul) Ri(dif) Ci(dif) VI fVCO(max) fVIF
65 - 70 1.7 1.2 -
69 15 100 2.2 1.7 3.35
- 25 - 2.7 2.5 - - - - - - - 30
dB MHz MHz k pF V
FPLL and true synchronous video demodulator; note 4 maximum oscillator frequency for carrier regeneration vision carrier operating frequencies f = 2fPC see Table 2 120 - - - - fVIF tacq Vi(sens)(VIF)(rms) VIF frequency window of digital referenced to fVIF acquisition help acquisition time VIF input voltage sensitivity at pins 1 and 2 (RMS value) for PLL to be locked for C/N = 10 dB SIGNAL AT PIN 18 Io(source)(PD)(max) maximum source current of phase detector output - 17 - A maximum IF gain notes 6 and 7 - - 30 100 70 140 V V BL = 70 kHz; note 5 - - 140 38.0 38.9 45.75 58.75 2.38 - MHz MHz MHz MHz MHz MHz ms
1999 Jul 21
10
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL Io(sink)(PD)(max) Io(source)(DAH) Io(sink)(DAH) tW(min)(DAH) KO(VIF) KD(VIF) PARAMETER maximum sink current of phase detector output output source current of digital acquisition help output sink current of digital acquisition help minimum pulse width of digital acquisition help current VCO steepness fVIF/V18 phase detector steepness I18/VIF video output signal voltage (peak-to-peak value) sync pulse voltage level zero carrier voltage level upper video clipping voltage level lower video clipping voltage level output resistance internal DC bias current for emitter-follower maximum AC and DC output source current maximum AC and DC output sink current deviation of CVBS output signal voltage black level tilt differential gain differential phase -3 dB video bandwidth including sound carrier trap 50 dB gain control 30 dB gain control note 3 see Fig.10 see Fig.10 see Fig.10 CONDITIONS - - - - - - MIN. TYP. 17 23 23 64 20 23 - - - - - -
TDA9880
MAX.
UNIT A A A s MHz/V A/rad
Video output signal and sound carrier trap (pin 13; sound carrier off) Vo(v)(p-p) Vsync Vzc Vv(clu) Vv(cll) Ro Ibias(int) Io(source)(max) Io(sink)(max) Vo Vo(bl) Gdif dif Bv(-3dB)(trap) 1.7 1.15 3.27 2.0 1.35 3.57 2.3 1.55 3.87 - 1.0 30 - - - 0.5 0.1 1 5 4 V V V V V mA mA mA dB dB % % deg
VP - 1.1 VP - 1 - - 2.0 2.4 1.4 - - - - - 0.7 - 2.5 - - - - - 2 2
"NTC-7 Composite" "NTC-7 Composite"
CL < 20 pF; RL > 1 k; AC load; note 8 ftrap = 4.5 MHz (M/N standard) ftrap = 5.5 MHz (B/G standard) ftrap = 6.0 MHz (I standard) ftrap = 6.5 MHz (D/K standard)
3.95 4.90 5.2 5.5
4.05 5.00 5.50 5.95
- - - -
MHz MHz MHz MHz
1999 Jul 21
11
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL SC1 PARAMETER trap attenuation at first sound carrier CONDITIONS M/N standard B/G standard I standard D/K standard SC1(60 kHz) trap attenuation at first sound carrier fSC1 60 kHz M/N standard B/G standard I standard D/K standard SC2 trap attenuation at second sound carrier M/N standard B/G standard I standard D/K standard SC2(60 kHz) trap attenuation at second sound carrier fSC2 60 kHz M/N standard B/G standard I standard D/K standard td(g)(CC) group delay at chrominance carrier frequency 3.58 MHz at M/N standard 4.43 MHz at I standard S/NW weighted signal-to-noise ratio weighted in accordance with "CCIR 567"; see Fig.6; note 9 note 9 f = 0.92 MHz; see Fig.7; note 10 f = 2.76 MHz; see Fig.7; note 10 dyellow intermodulation attenuation at `yellow' f = 0.92 MHz; see Fig.7; note 10 f = 2.76 MHz; see Fig.7; note 10 Vr(vc)(rms) H(sup) H(spur) PSRR13 residual vision carrier (RMS value) harmonics suppression in video signal fundamental wave and harmonics CL < 20 pF; RL > 1 k; AC load; note 11a MIN. 30 30 26 26 21 24 20 20 21 21 12 18 15 15 10 13 110 TYP. 36 36 32 32 27 30 26 26 27 27 18 24 21 21 15 18 180 180 90 60 60 - - - - - - - - - - - - - - - -
TDA9880
MAX.
UNIT dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns ns ns dB
250 250 160 130 -
4.43 MHz at B/G standard 110 - 56 4.28 MHz at D/K standard -
S/NUW dblue
unweighted signal-to-noise ratio intermodulation attenuation at `blue'
47 58 58 60 59 - 35 40 25
51 64 64 66 65 2 40 - 28
- - - - - 5 - - -
dB dB dB dB dB mV dB dB dB
spurious elements suppression note 11b in video signal power supply ripple rejection at fripple = 70 Hz; video pin 13 signal; grey level; see Fig.9
1999 Jul 21
12
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9880
MAX.
UNIT
Video output signal (pin 13; trap bypass mode; V12 < 0.8 V; sound carrier off); see Fig.10; note 12 Vo(v)(p-p) Vsync Vzc Vv(clu) Vv(cll) Bv(-1dB) Bv(-3dB) S/NW video output signal voltage (peak-to-peak value) sync pulse voltage level zero carrier voltage level upper video clipping voltage level lower video clipping voltage level -1 dB video bandwidth -3 dB video bandwidth weighted signal-to-noise ratio CL < 20 pF; RL > 1 k; AC load CL < 20 pF; RL > 1 k; AC load weighted in accordance with "CCIR 567"; see Fig.6; note 9 note 9 see Fig.10 0.95 1.4 2.57 3.1 - 5 7 56 1.10 1.5 2.72 3.25 1.15 6 8 60 1.25 1.6 2.87 - 1.3 - - - V V V V V MHz MHz dB
S/NUW
unweighted signal-to-noise ratio
49
53
-
dB
Trap control (pin 12) Io(source)(max) Io(sink)(max) KD(trap) maximum output source current maximum output sink current frequency detector steepness I12/ftrap ftrap = 4.5 MHz (M/N standard) ftrap = 6.5 MHz (D/K standard) V12 IL(12) CRstps operating voltage range of trap frequency control at pin 12 leakage current at pin 12 control steepness ftrap/V12 ftrap < 25 kHz ftrap = 4.5 MHz (M/N standard) ftrap = 6.5 MHz (D/K standard) Vsw Isource switching voltage source current trap bypass mode active trap bypass mode active; V12 0.8 V 5 9 - - 1.5 - - - - - 9 13 -8 -5.5 - - 4.5 9 - 185 13 17 - - 3.5 80 - - 0.8 - A A A/MHz A/MHz V nA MHz/V MHz/V V A
VIF-AGC detector (pin 20) Ich(max)(20) Idch(max)(20) tres(inc) maximum charge current maximum discharge current AGC response time to an increasing VIF step 6 dB; note 13 20 dB; note 13 40 dB; note 13 6 7.5 - - - 8 10 2.0 2.5 4.0 10 12.5 - - - A A ms ms ms
1999 Jul 21
13
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL tres(dec) PARAMETER AGC response time to a decreasing VIF step CONDITIONS -6 dB; note 13 -20 dB; note 13 -40 dB; note 13 V20 CRstps Vi(VIF)(min)(rms) gain control voltage range at pin 20 control steepness GIF/V20 V20 = 2.2 to 3.2 V - - - 1.7 - - MIN. TYP. 1.0 1.5 2.5 - -40 2 - - -
TDA9880
MAX.
UNIT ms ms ms V dB/V
3.6 - 5
Tuner AGC (pin 14); see Figs 4 and 5 VIF input signal voltage for RTOP = 22 k; minimum starting point of tuner I14 = 120 A takeover at pins 1 and 2 (RMS value) VIF input signal voltage for maximum starting point of tuner takeover at pins 1 and 2 (RMS value) tuner takeover point accuracy (RMS value) permissible output voltage saturation voltage variation of takeover point with temperature sink current RTOP = 0 ; I14 = 120 A mV
Vi(VIF)(max)(rms)
45
90
-
mV
QVi(VIF)(rms) Vo Vsat Vi(VIF)(rms)/T Isink
RTOP = 12 k; I14 = 120 A from external source I14 = 450 A I14 = 120 A no tuner gain reduction; see Fig.4 V14 = 12 V V14 = 13.2 V maximum tuner gain reduction; V14 = 1 V; see Fig.4
5 - - -
10 - - 0.03
20 13.2 0.2 0.07
mV V V dB/K
- - 450
- - 600
0.75 1.5 750
A A A
GIF
IF slip by automatic gain control AFC steepness I19/fVIF accuracy of AFC circuit upper limit saturation voltage lower limit saturation voltage output source current output sink current
tuner gain current from 20% to 80%
-
5
8
dB
AFC circuit (pin 19); notes 14 and 15 AFCstps QfVIF Vsat(ul) Vsat(ll) Io(source) Io(sink) 0.85 Io(19) = 0; f15 = 4.0 MHz see Fig.8 see Fig.8 -20 - 160 160 1.05 - 0.3 200 200 1.25 +20 0.6 240 240 A/kHz kHz V V A A
VP - 0.6 VP - 0.3 -
1999 Jul 21
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Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL PARAMETER CONDITIONS - V i(SC) ------------- = - 24 dB ; note 16 V i(PC) 7.5 fundamental wave and harmonics note 3 - - 1.85 0.9 note 17 note 17 automatic audio mute function activated; note 17 0.6 0.6 0.75 MIN. TYP. - - - 70
TDA9880
MAX.
UNIT
Intercarrier mixer (pin 11) Vo(intc)(rms) intercarrier output voltage (RMS value) upper limit -3 dB intercarrier bandwidth residual sound carrier (RMS value) output resistance DC output voltage internal DC bias current for emitter-follower maximum AC output source current maximum AC output sink current DC output source current 49 mV
Bintc(-3dB)(ul) Vr(SC)(rms) Ro VO Ibias(int) Io(source)(max) Io(sink)(max) IO(source)
9 2 - 2.05 1.15 0.8 0.8 0.93
MHz mV V mA mA mA mA
2.35 - - - 1.20
FM-PLL demodulator; notes 15 and 18 to 21 fintc sound intercarrier operating frequencies see Table 2 - - - - fFM frequency window of digital acquisition help for FM demodulator IF intercarrier level for gain corresponding PC/SC controlled operation of FM-PLL ratio at input pins 1 and 2 (RMS value) is 7 to 40 dB IF intercarrier level for lock-in of PLL (RMS value) IF intercarrier gain control range - 4.5 5.5 6.0 6.5 225 - - - - - MHz MHz MHz MHz kHz
VFM(rms)
6
-
320
mV
VFM(lock)(rms) GFM SIGNAL AT PIN 7 V7 Ich(max)(7) Idch(max)(7) CRstps SIGNAL AT PIN 8 Vo(AF)(rms)
- 30
- 34
3 -
mV dB
gain control voltage range at pin 7 maximum charge current maximum discharge current control steepness GFM/V7 audio output signal voltage (RMS value) V7 = 2.2 to 2.7 V 25 kHz FM deviation 27 kHz FM deviation
1.5 1.5 1.5 - 400 432
- 2.2 2.2 -30 500 540
3.5 2.9 2.9 - 600 648
V A A dB/V
mV mV
1999 Jul 21
15
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL Vo(AF)(cl)(rms) THD Vo(AF)/T fAF BAF(-3dB) PARAMETER audio output clipping signal voltage level (RMS value) total harmonic distortion temperature drift of AF output signal voltage audio frequency deviation -3 dB audio frequency bandwidth THD < 1.5%; note 22 CONDITIONS THD < 1.5% MIN. 1.3 - - - TYP. 1.4 0.15 -
TDA9880
MAX. V
UNIT
0.5
%
3 x 10-3 7 x 10-3 dB/K - 100 55 - kHz kHz
without de-emphasis; 80 dependent on loop filter at pin 4; measured in accordance with Fig.19 black picture white picture 6 kHz sine wave (black-to-white modulation) sound carrier subharmonics; f = 2.25 MHz 3 kHz 50 45 40
S/NW
weighted signal-to-noise ratio of audio signal
56 51 46
- - -
dB dB dB
35
40
-
dB
Vr(SC)(rms)
residual sound carrier (RMS value) AM suppression of FM demodulator
fundamental wave and harmonics; without de-emphasis 75 s de-emphasis; AM: f = 1 kHz; m = 0.3 referenced to 25 kHz FM deviation
-
-
2
mV
AM(sup)
40
46
-
dB
PSRR8 SIGNAL AT PIN 4
power supply ripple rejection at fripple = 70 Hz; see Fig.9 pin 8
14
20
-
dB
Io(source)(PD)(max) maximum phase detector output source current Io(sink)(PD)(max) Io(source)(DAH) Io(sink)(DAH) tW(DAH) Tcy(DAH) KO(FM) KD(FM) maximum phase detector output sink current output source current of digital acquisition help output sink current of digital acquisition help pulse width of digital acquisition help current cycle time of digital acquisition help VCO steepness fFM/V4 phase detector steepness I4/FM
- - - - - - - -
86 80 110 110 16 64 3.3 9
- - - - - - - -
A A A A s s MHz/V A/rad
1999 Jul 21
16
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9880
MAX.
UNIT
Audio amplifier (pins 5, 6 and 8) Ro(5) VAF(5)(rms) VO(5) Ro(8) VO(8) Io(source)(max)(8) Io(sink)(max)(8) V6 IL(6) Ich(max)(6) Idch(max)(6) BAF(-3dB) mute(8) V8 output resistance at pin 5 audio signal (RMS value) at pin 5 DC output voltage at pin 5 output resistance at pin 8 DC output voltage at pin 8 maximum AC and DC output source current at pin 8 maximum AC and DC output sink current at pin 8 DC decoupling voltage at pin 6 dependent on intercarrier frequency fFM leakage current at pin 6 maximum charge current at pin 6 maximum discharge current at pin 6 -3 dB audio frequency bandwidth of audio amplifier mute attenuation of AF signal at pin 8 DC jump voltage at pin 8 for switching AF output to mute state and vice versa upper limit lower limit; note 24 note 17 activated by digital acquisition help; note 17 VO(8) < 50 mV note 3 note 23 4.4 - - - - - - 1.5 - 1.15 1.15 150 - 70 - 5.0 170 2.37 - 2.37 - - - - 1.5 1.5 - - 75 50 5.6 - - 200 - 0.5 0.5 3.3 25 1.85 1.85 - 20 - 150 k mV V V mA mA V nA A A kHz Hz dB mV
Standard switch (pins 9 and 10); see Table 2 Vi input voltage pin open-circuit; Ii(9,10) < 0.1 A for LOW for MID for HIGH Ii(source) input source current Vi(9,10) = 0 V Vi(9,10) = 1.8 V Reference input (pin 15); note 25 VI Ri Rxtal Cx fref fref DC input voltage input resistance resonance resistance of crystal operation as crystal oscillator pull-up/down capacitance frequency of reference signal tolerance of reference frequency note 15 note 26 2.3 2.5 - - - - 2.6 3.0 - - 4.0 - 2.9 3.5 200 - - 0.1 V k pF MHz % 2.8 0 1.3 2.8 87 33 3.0 - 1.8 - 105 39 3.6 0.8 2.3 VP 122 45 V V V V A A
1999 Jul 21
17
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SYMBOL Vref(rms) Ro(ref) CK Notes 1. Values of video and sound parameters can be decreased at VP = 4.5 V. 2. This parameter is tested with 110 mV to ensure maximum input level. PARAMETER amplitude of reference signal source (RMS value) output resistance of reference source decoupling capacitance to external reference source operation as input terminal CONDITIONS operation as input terminal MIN. 80 - 22 - - 100 TYP.
TDA9880
MAX. 400 4.7 -
UNIT mV k pF
3. This parameter is not tested during production and is only given as application information for designing the television receiver. 4. Loop bandwidth BL = 70 kHz (damping factor d = 1.9; calculated with sync level within gain control range). Calculation of the VIF-PLL filter can be done by use of the following formulae: 1 BL -3 dB = ------ K O K D R , valid for d 1.2 2 1 d = -- R K O K D C , 2 where: rad Hz A KO = VCO steepness ------- or 2 ------ ; KD = phase detector steepness ------- ; V - rad V R = loop resistor; C = loop capacitor; BL-3 dB = loop bandwidth for -3 dB; d = damping factor. 5. Vi(VIF)(rms) = 10 mV; f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video modulation. 6. Vi(VIF) signal for nominal video signal. 7. Broadband transformer at VIF input. The C/N ratio at VIF input is defined as the VIF input signal (sync level, RMS value) related to a superimposed 4.2 MHz band-limited white noise signal (RMS value); white picture video modulation. 8. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps (see Figs 13 to 18); H (s) is the absolute value of transfer function. 9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard). 10. The intermodulation figures are defined: V 0 at 3.58 MHz d 0.92 = 20 log -------------------------------------- + 3.6 dB ; d0.92 value at 0.92 MHz referenced to black or white signal; V 0 at 0.92 MHz V 0 at 3.58 MHz d 2.76 = 20 log -------------------------------------- ; d2.76 value at 2.76 MHz referenced to chrominance carrier. V 0 at 2.76 MHz 11. Measurements taken with SAW filter M1963M (sound shelf: 20 dB); loop bandwidth BL = 70 kHz. a) Modulation Vestigial Side-Band (VSB); sound carrier off; fvideo > 0.5 MHz. b) Sound carrier on; fvideo = 10 kHz to 10 MHz. 12. The sound carrier trap can be disabled by switching pin 12 to ground (<0.8 V). In this way the full composite video spectrum appears at pin 13. The amplitude is 1.1 V (p-p). 13. Response time valid for a VIF input level range of 200 V to 70 mV.
1999 Jul 21
18
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.8. The AFC steepness can be changed by resistors R1 and R2. 15. The tolerance of the reference frequency determines the accuracy of the VIF AFC, FM demodulator centre frequency and maximum FM deviation. 16. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal video signal with 1.1 V (p-p) as a reference:
V i ( SC ) --------------- ( dB ) + 6 dB 3 dB V i ( PC ) --------------------------------------------------------------20
1 V o(intc)(rms) = 1.1 V (p-p) x ---------- x 10 22 where:
V i ( SC ) 1 ---------- = correction term for RMS value, --------------- ( dB ) = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB, V i ( PC ) 22 6 dB = correction term of internal circuitry and 3 dB = tolerance of video output and intercarrier output amplitude Vo(intc)(rms). 17. For normal operation no DC load at pin 11 is allowed, so the automatic audio mute function is not active. By connecting a 2.2 k resistor between pin 11 and ground the automatic audio mute function will be activated. With this application also the series capacitor CS of the loop filter at pin 4 should be changed from 33 nF to 4.7 nF. 18. Calculation of the FM-PLL filter can be done approximately by use of the following formulae: 1 KO KD f o = ------ -------------2 C P 1 = ----------------------------------2R K O K D C P BL -3 dB = f o ( 1.55 - ) The formulae are only valid under the following conditions: 1 and CS > 5CP where: rad Hz A KO = VCO steepness ------- or 2 ------ ; KD = phase detector steepness ------- ; V - rad V RS = loop resistor; CS = series capacitor; CP = parallel capacitor; fo = natural frequency of PLL; BL-3 dB = loop bandwidth for -3 dB; = damping factor. For examples see Table 1. 19. For all S/N measurements the used vision IF modulator requires an incidental phase modulation for black-to-white jump of less than 0.5 degrees. 20. Measurements taken with SAW filter M1963M (Siemens) for vision and sound IF (sound shelf: 20 dB). Picture-to-sound carrier ratio of transmitter: PC/SC = 10 dB. Input level (at pins 1 and 2) Vi(VIF)(rms) = 10 mV (sync level), 25 kHz FM deviation for sound carrier, fAF = 400 Hz. Measurement in accordance with "CCIR 468-4". De-emphasis = 75 s. 21. The PC/SC ratio is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values. 22. Measured with an FM deviation of 25 kHz, the typical AF output signal is 500 mV (RMS). By using Rx = 20 k the AF output signal is attenuated by 6 dB, so 250 mV (RMS). For handling an FM deviation of more than 55 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to 100 kHz an attenuation of 6 dB is recommended. 23. CDEEM = 10 nF results in = 50 s and CDEEM = 15 nF results in = 75 s.
2
1999 Jul 21
19
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
24. The lower limit of audio bandwidth depends on the value of the capacitor at pin 6. A value of CAFD = 470 nF leads to fAF(-3 dB) 20 Hz and CAFD = 220 nF leads to fAF(-3 dB) 40 Hz. 25. The reference input pin 15 is able to operate as a 1-pin crystal oscillator as well as an input terminal with external reference signal, e.g. from the tuning system. 26. The value of Cx determines the accuracy of the resonance frequency of the crystal. It depends on the type of crystal used. Table 1 Examples to note 18 of Chapter "Characteristics" BL-3 dB (kHz) 100 160 Table 2 Standard switch settings S0 LOW LOW LOW MID MID MID HIGH HIGH HIGH S1 LOW MID HIGH LOW MID HIGH LOW MID HIGH fVIF (MHz) 38.9 38.9 38.9 38.0 38.0 38.0 45.75 38.0 58.75 fintc (MHz) 5.5 6.5 6.0 5.5 6.0 6.5 4.5 4.5 4.5 STANDARD B/G D/K I B/G I D/K M/N M M Japan USA United Kingdom REMARK Europe CS (nF) 33 33 CP (pF) 820 330 R (k) 2.7 3.9 0.5 0.5
1999 Jul 21
20
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
MHB158
handbook, halfpage V
20 (V)
I14 (A) 600 500 400
handbook, halfpage
120
MHB159
4
Vi(VIF) (dB/V)
100
3 300 200
(1) (2) (3) (4)
90
80
2
100 0 70
1 30
50
70
90 110 Vi(VIF) (dB/V)
60 0 4 8 12 16 20 24 RTOP (k)
(1) VIF AGC voltage. (2) Ituner; RTOP = 22 k.
(3) Ituner; RTOP = 12 k. (4) Ituner; RTOP = 0 .
Fig.5 Fig.4 Typical VIF and tuner AGC characteristic.
Typical tuner takeover point as a function of RTOP.
MHB160
handbook, halfpage
70
S/N (dB) 60 50
handbook, halfpage
3.2 dB 10 dB 13.2 dB 21 dB
13.2 dB 21 dB 40 30 SC CC 20 PC
SC CC
PC
BLUE
10 0 30
YELLOW
MHA739
50
70
90 Vi(VIF) (dB/V)
110 SC = sound carrier, with respect to sync level. CC = chrominance carrier, with respect to sync level. PC = picture carrier, with respect to sync level. The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter M1963M).
Fig.6
Typical signal-to-noise ratio as a function of VIF input voltage.
Fig.7 Input signal conditions.
1999 Jul 21
21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
handbook, full pagewidth
lock range without SAW filter 5 V19 (V) VP 4 -200 I19 (A) -100 I19 R1 22 k 3 0 R2 22 k 2 100 1 200
MHB075
TDA9880 19
0 43 44 45 45.56 45.75 46 45.94 47 f (MHz) 48
Fig.8 Measurement conditions and typical AFC characteristic.
handbook, full pagewidth
VP = 5 V VP = 5 V
100 mV (fripple = 70 Hz)
TDA9880
MHB076
t
Fig.9 Ripple rejection condition.
1999 Jul 21
22
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
handbook, full pagewidth
trap bypass mode normal mode 2.72 V 2.6 V 3.57 V 3.35 V zero carrier level white level
1.83 V
1.95 V
black level
1.5 V
1.35 V
sync level
MHB163
Fig.10 Typical video signal levels on output pin 13 (sound carrier off).
handbook, full pagewidth
10
MHB164
audio S/N 0 (dB) -10 -20 -30 -40
(1)
(2)
-50
(3)
-60 -70
49
46
43
40
37
34
31
28
25
22
19
16
13
10
7
4
gain controlled operation of FM-PLL PC/SC ratio at pins 1 and 2 (dB)
Conditions: 25 kHz FM deviation; 75 s de-emphasis. (1) Signal. (2) Noise at H-picture. (3) Noise at black picture.
Fig.0 Audio S/N as a function of picture-to-sound carrier ratio.
1999 Jul 21
23
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
MHB079
handbook, full pagewidth
120
1 video 1.1 V (p-p)
antenna input (dBV)
(1)
100
SAW insertion loss 14 dB IF slip 6 dB
10-1 IF signals RMS value (V) 10-2 (TOP)
80 tuner gain control range
70 dB VIF AGC 10-3 0.66 x 10-3 SAW insertion loss 14 dB
60
40 40 dB RF gain
10-4
20
10-5 0.66 x 10-5
10 VHF/UHF tuner tuner VIF SAW filter VIF amplifier, demodulator and video TDA9880
(1) Depends on TOP.
Fig.12 Front-end level diagram.
1999 Jul 21
24
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
handbook, full pagewidth
10 H (s) (dB) 0
MHB166
-10
-20
-30
minimum requirements
-40
2
2.5
3
3.5
4
4.5 f (MHz) 5
Fig.13 Typical amplitude response for sound trap at M/N standard (including Korea).
handbook, full pagewidth
400 group delay (ns) 300
MHB167
200 ideal characteristic due to pre-correction in the transmitter 100
0
minimum requirements
-100
0
0.5
1
1.5
2
2.5
3
3.5
f (MHz)
4
Remark: overall delay is not shown, here the maximum ripple is specified.
Fig.14 Typical group delay for sound trap at M/N standard.
1999 Jul 21
25
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
handbook, full pagewidth
10 H (s) (dB) 0
MHB168
-10
-20
-30
minimum requirements
-40
4
4.5
5
5.5
6
6.5 f (MHz) 7
Fig.15 Typical amplitude response for sound trap at B/G standard.
handbook, full pagewidth
400 group delay (ns) 300
MHB169
200
ideal characteristic due to pre-correction in the transmitter
100
0
minimum requirements
-100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5 f (MHz) 5
Remark: Overall delay is not shown, here the maximum ripple is specified.
Fig.16 Typical group delay for sound trap at B/G standard.
1999 Jul 21
26
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
MHB170
handbook, full pagewidth
10 H (s) (dB) 0
-10
-20
-30
minimum requirements
-40
4
4.5
5
5.5
6
6.5 f (MHz) 7
Fig.17 Typical amplitude response for sound trap at I standard.
MHB171
handbook, full pagewidth
10 H (s) (dB) 0
-10
-20
-30
minimum requirements
-40
4
4.5
5
5.5
6
6.5 f (MHz) 7
Fig.18 Typical amplitude response for sound trap at D/K standard.
1999 Jul 21
27
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Jul 21
(1)
TEST CIRCUIT
Philips Semiconductors
Alignment-free multistandard vision and FM sound IF-PLL demodulator
AFC output
VIF-PLL filter
VP
TAGC output
CVBS output
sound intercarrier output auto mute 2.2 k
1.5 k
22 k
100 nF
R 150 C 220 nF 10 nF
4 MHz Cx(3) fref
10 nF
CTR 470 nF
3.3 M
CVAGC 10 nF VAGC 20
22 k
bypass TAGC 14 13 CVBS TR 12 SIO 11
AFC 19 18
VPLL
VP 17
GND 16 15
REF
TDA9880
(1) (2) (3) (4)
See note 4 of Chapter "Characteristics". See notes 17 and 18 of Chapter "Characteristics". See note 26 of Chapter "Characteristics". See note 22 of Chapter "Characteristics".
handbook, full pagewidth
28
1 VIF1 2 VIF2 3 TOP 4 FMPLL 5 DEEM 6 AFD 470 nF 22 k 50 RTOP RS 2.7 k CS 33 nF CP 820 pF CDEEM 15 nF
(4)
7 FAGC
8 AUD
9 S0
10 S1
1:1 IF input
CFAGC 100 nF
L H
ML H 47 k
M
Rx
47 k
FM-PLL filter
(2)
audio output
logic
MHB162
Product specification
TDA9880
Fig.19 Test circuit.
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
INTERNAL PIN CONFIGURATIONS
TDA9880
+ handbook, halfpage
1 1.1 k 5 k
handbook, halfpage
30 k 20 k
+
1.1 k 2 2.65 V
MHB087
+
3.55 V 3 1.9 V 9 k
3.55 V
MHB088
Fig.20 Pin 1 (VIF1) and pin 2 (VIF2).
Fig.21 Pin 3 (TOP).
handbook, halfpage maximum 100 A
handbook, halfpage
+
240 A
+
5.0 k 5
4
MHB090
maximum 100 A
MHB089
Fig.22 Pin 4 (FMPLL).
Fig.23 Pin 5 (DEEM).
1999 Jul 21
29
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
+
handbook, halfpage
TDA9880
handbook, halfpage
+
maximum 2.2 A
+
maximum 1.5 A 6 maximum 1.5 A
maximum 2.2 A 7 2 k
1.5 V
MHB092
MHB091
Fig.24 Pin 6 (AFD).
Fig.25 Pin 7 (FAGC).
handbook, halfpage
+
+
handbook, halfpage
600 A
+
+
9 15 k 8 10 pF 3.55 V
MHB094 MHB093
27 k
Fig.26 Pin 8 (AUD).
Fig.27 Pin 9 (S0).
handbook, halfpage
+
handbook, halfpage
+
14.7 k 11
10 27 k 3.55 V
MHB095
1.2 mA
MHB096
Fig.28 Pin 10 (S1).
Fig.29 Pin 11 (SIO).
1999 Jul 21
30
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
handbook, halfpage
maximum 150 A maximum 9 A
+
1 k 12
handbook, halfpage
+
10 k 13 7 k
+
maximum 13 A 500
MHB098
2.5 mA
1.1 V
MHB165
Fig.30 Pin 12 (TR).
Fig.31 Pin 13 (CVBS).
handbook, halfpage
+
handbook, halfpage
14 15 maximum 600 A
MHB099
3 k
200 A
MHB100
Fig.32 Pin 14 (TAGC).
Fig.33 Pin 15 (REF).
handbook, halfpage
GND 16
MHB101
handbook, halfpage
17
+
MHB102
Fig.34 Pin 16 (GND).
Fig.35 Pin 17 (VP).
1999 Jul 21
31
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
handbook, halfpage
+
handbook, halfpage
+
+
VCO 25 k
maximum 200 A 19
18 maximum 15 A maximum 5 A
1 k
1 k
MHB104
MHB103
Fig.36 Pin 18 (VPLL).
Fig.37 Pin 19 (AFC).
handbook, halfpage
+
maximum 8 A 20 maximum 10 A
MHB105
Fig.38 Pin 20 (VAGC).
1999 Jul 21
32
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
PACKAGE OUTLINES SDIP20: plastic shrink dual in-line package; 20 leads (300 mil)
TDA9880
SOT325-1
D seating plane
ME
A2
A
L
A1 c Z e b1 b 20 11 wM (e 1) MH
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.2 A1 min. 0.51 A2 max. 3.2 b 1.3 1.0 b1 0.53 0.38 c 0.32 0.20 D (1) 19.50 18.55 E (1) 6.48 6.14 e 1.778 e1 7.62 L 3.2 2.8 ME 8.25 7.80 MH 10.0 8.3 w 0.18 Z (1) max. 1.9
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT325-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-13 95-02-04
1999 Jul 21
33
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
TDA9880
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Jul 21
34
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
TDA9880
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 35
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
Suitability of IC packages for wave, reflow and dipping soldering methods
TDA9880
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. suitable(2) not suitable not suitable(3) suitable not not recommended(4)(5) recommended(6) REFLOW(1) - suitable suitable suitable suitable suitable - - - - - DIPPING suitable
1999 Jul 21
36
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
NOTES
TDA9880
1999 Jul 21
37
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
NOTES
TDA9880
1999 Jul 21
38
Philips Semiconductors
Product specification
Alignment-free multistandard vision and FM sound IF-PLL demodulator
NOTES
TDA9880
1999 Jul 21
39
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/03/pp40
Date of release: 1999
Jul 21
Document order number:
9397 750 05318

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